Intel S Sunny Cove Architecture What You Need To Know
At an Architecture Day event in Santa Clara, company executives spoke about the technique being used to develop future processors. Chief among those is what Intel calls Foveros, a new 3D packaging technology in which processors are stacked on top of each other. The idea is to shorten the distance between electric signals, thereby improving power consumption and performance. Credit: Intel The technique allows Intel to match different dies – CPUs, GPUs, and Ai processors – to create an efficient system-on-a-chip (SOC)....